Broadcom has introduced its new BCM677x family of dual-band Wi-Fi 8 system-on-chips designed to simplify the construction of mesh nodes, Ethernet routers, and fixed wireless access gateways.
The family consists of three separate silicon designs—the BCM6772, BCM6774, and BCM6776—each combining an application processor, a network routing engine, dual-band Wi-Fi 8 radios, and Multi-Gigabit Ethernet physical layers onto a single die. Broadcom said this consolidated architecture decreases the physical component count and heat output of next-generation hardware. This allows manufacturers to build smaller, more compact mesh nodes and multi-gigabit home routers without requiring complex multi-chip configurations.
Each system-on-chip in the BCM677x lineup includes integrated 2.4 GHz power amplifiers, a quad-core CPU, a dedicated Network Processing Engine, and digital pre-distortion technology to reduce energy draw on the 5 GHz band. However, the three designs differ in their target roles and physical specifications.
The BCM6772 serves as the baseline for mass-market routers and extenders, featuring 2x2 radio configurations for both the 2.4 GHz and 5 GHz bands. It is packaged in a 15x15 mm FCBGA footprint and supports both DDR4 and DDR5 memory. The BCM6774 scales up the 5 GHz band to a 4x4 radio configuration while maintaining the same physical package size and memory support.
The top-tier BCM6776 is designed for premium hardware. It features a 2x2 2.4 GHz radio and a 4x4 5 GHz radio, and it can be paired with Broadcom's existing BCM6718 co-processor to support tri-band configurations. The BCM6776 is housed in a larger 19x19 mm package, incorporates dual PCIe Gen3 controllers, and expands memory compatibility to include LPDDR4 and LPDDR5.
In addition to standard router designs, Broadcom partnered with Samsung to create a reference platform for fixed wireless access using the BCM6776 and Samsung's B1320 5G cellular modem. The B1320 is a 3GPP Release 17 cellular chip that supports downlink speeds up to 3.43 Gbps and uplink speeds up to 1.17 Gbps. This integrated hardware platform will allow network operators to deploy all-in-one Wi-Fi 8 gateways with integrated 5G connectivity for primary or backup broadband.
Broadcom is currently sampling the BCM677x silicon to early-access partners and carrier customers. Consumer networking devices built on these chips are expected to begin appearing on store shelves by late 2027 or early 2028.
